ELECTRONIC COMPONENT AND METHOD FOR CLEANING BONDING TOOL
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 17, 2024
filing date -
Sep 17, 2024
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Abstract
An electronic component is provided that includes a package, at least one electronic chip housed within an enclosure inside the package, and at least one first bonding pad, at least one second bonding pad, and at least one bond connected to at least one bonding pad and at least one second bonding pad for establishing an electric connection between the electronic chip and surrounding circuitry. A cleaning pad is provided in the package. The cleaning pad is spaced from first bonding pad and second bonding pad, designed to be electrically disconnected from other structures or components, and designed to enable cleaning of a bonding tool.
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