APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE

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United States of America Patent

APP PUB NO 20250100029A1
SERIAL NO

18975080

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Abstract

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The inventive concept provides a substrate treating method. The substrate treating method includes first treating a substrate in a treating space according to a reference recipe; second treating a substrate in the treating space according to the reference recipe after the first treating; and optimizing an inner ambient of the treating space according to the reference recipe, and wherein the optimizing includes a purge operation of supplying and discharging a treating fluid to/from the treating space.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTDCHUNGNAM SOUTH KOREA JEOLLANAM-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KANG, Ki-Moon Yongin-si, KR 11 24
OH, Seung Un Cheonan-si, KR 10 0

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