RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 27, 2025
app pub date -
Oct 19, 2023
filing date -
Oct 19, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The resin composition according to an exemplary embodiment of the present application comprises: an epoxy-based resin; a curing agent comprising a cyanate ester-based resin and a phenolic resin; inorganic particles comprising silica particles; and a curing accelerator, the weight ratio of the cyanate ester-based resin:the phenolic resin is 95:5 to 40:60, and the curing accelerator comprises both an imidazole-based compound and a metal-based compound.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully