TWO-PART THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Jan 26, 2023
filing date -
Jan 26, 2023
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Abstract
A two-part thermally conductive resin composition can be cured at normal temperature. A cured product has a sufficient resin elongation percentage. A two-part thermally conductive resin composition comprising a component (A) to a component (F): component (A): an epoxy resin (excluding epoxy resins having a (meth) acrylic-based polymer skeleton); component (B): a metal catalyst; component (C): an acrylic-based polymer and/or a polyether polyol (excluding component (D)); component (D): a crosslinkable silyl-containing organic polymer; component (E): an epoxy curing agent; and component (F): a heat dissipating filler.
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