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Abstract

A thermally conductive silicone composition includes a silicone resin component and a thermally conductive filler (C), the silicone resin component comprising an organopolysiloxane (A) having alkenyl groups at least at both ends, an organohydrogenpolysiloxane (B) having at least one hydrogen atom bonded to a silicon atom in one molecule, and a hydrosilylation catalyst (D). The organopolysiloxane (A) is a phenyl-modified organopolysiloxane having at least one phenyl group in a molecule. The organohydrogenpolysiloxane (B) is a phenyl-modified organohydrogenpolysiloxane having at least one phenyl group in a molecule. A blending ratio of the thermally conductive filler (C) is 200 to 1500 parts by weight based on 100 parts by weight of the silicone resin component. A hardness of a cured product of the thermally conductive silicone composition is 70 or less in terms of Asker C hardness (in accordance with JIS K6249).

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First Claim