CMP POLISHING SOLUTION, STORAGE SOLUTION, AND POLISHING METHOD
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Jan 12, 2022
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Jan 12, 2022
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Abstract
A CMP polishing solution containing abrasive grains, an iron ion supplying agent, an organic acid, an oxidizing agent, and an aqueous liquid medium, in which the abrasive grains include silica particles having sulfo groups and silica particles not having sulfo groups.
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