POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 19, 2024
filing date -
Sep 19, 2024
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Abstract
The present document relates to a polishing composition that includes at least one abrasive, at least one pH adjuster, at least one guanamine compound, and water. The polishing composition can be used in a method of polishing a substrate including applying the polishing composition to a surface of a substrate and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate. The surface of the substrate can include tungsten and/or molybdenum.
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