MATERIAL DEPOSITION APPARATUS, METHOD OF DEPOSITING MATERIAL ON A SUBSTRATE, AND MATERIAL DEPOSITION SYSTEM
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Dec 9, 2024
filing date -
Dec 9, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A material deposition apparatus for depositing an evaporated material onto a substrate is provided. The material deposition apparatus includes a processing drum having a cooler configured to control a substrate temperature during processing of a substrate on the processing drum; a roller guiding the substrate towards the processing drum; a first heater assembly positioned to heat the substrate in a free-span area between the roller and the processing drum; a second heater assembly positioned to heat the substrate while being supported on the processing drum; at least one deposition source provided along a substrate transport path downstream of the second heater assembly; a substrate speed sensor providing a speed signal correlating with a substrate transportation speed; and a controller having an input for the speed signal configured to control at least the first heater assembly.
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