PRESSURE RELIEF ARRANGEMENT IN REFRIGERANT CIRCUITS
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Nov 12, 2024
filing date -
Nov 12, 2024
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Abstract
A pressure relief arrangement in refrigerant circuits with one high-pressure side and one low-pressure side, which is characterized in that the high-pressure side is fluidically connected with the low-pressure side of the refrigerant circuit via an overpressure relief device, wherein the overpressure relief device causes pressure reduction of the overpressure in the case of overpressure on the high-pressure side and fluid flows from the high-pressure side to the low-pressure side of the refrigerant circuit.
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