RELEASE FILM AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT USING THE SAME

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United States of America Patent

APP PUB NO 20250104915A1
SERIAL NO

18733071

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A release film including: a base film; and a release layer disposed on one surface of the base film, wherein the release layer is a cured layer of a release composition including a heterocyclic compound including nitrogen and polydimethylsiloxane, and when analyzing a surface using X-ray photoelectron spectroscopy (XPS), the release layer has an atomic ratio of nitrogen (N) to silicon (Si) (N/Si) of 0.6 to 1.1.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO 16674 16674

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Hyo Sung Suwon-si, KR 7 4
KIM, Jae Won Suwon-si, KR 100 290
KIM, Jung Hee Suwon-si, KR 35 152
LEE, Jong Ho Suwon-si, KR 415 3173
PARK, Jung Jin Suwon-si, KR 1 0
PARK, Jung Jin Suwon-si, KR 13 35
SHIM, Dae Jin Suwon-si, KR 5 0
YOO, Nam Ju Suwon-si, KR 1 0

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