MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20250104922A1
SERIAL NO

18776769

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Abstract

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A multilayer electronic component according to an example embodiment may include: a body including a plurality of dielectric layers, a first internal electrode, a second internal electrode, and a margin pattern; and an external electrode disposed on the body. The first and second internal electrodes may be alternately disposed in a first direction with the dielectric layer interposed therebetween, and the margin pattern may be disposed in a position different from the first and second internal electrodes in the first direction and may be disposed so as not to overlap the first internal electrode or the second internal electrode in the first direction.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU GYEONGGI-DO SUWON-SI 16674

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HWANG, Jung Wun Suwon-si, KR 4 1
KIM, Jae Hee Suwon-si, KR 38 402
LEE, Chae Dong Suwon-si, KR 8 2
OH, Ji Hye Suwon-si, KR 21 84
PARK, Sang Hyun Suwon-si, KR 240 2164
PARK, Sun Kyoung Suwon-si, KR 11 20

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