Importance

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Abstract

An electronic component includes: a substrate; a plurality of multilayer capacitors mounted on a first main surface of the substrate; and a sealing part formed of a resin and sealing the plurality of multilayer capacitors. A first external electrode and a second external electrode of the multilayer capacitor are mounted on the substrate by solder. At least a part of adjacent multilayer capacitors overlaps each other when viewed from a direction in which a pair of side surfaces of an element body are opposed to each other, the direction being along the first main surface of the substrate. In the adjacent multilayer capacitors, stacking directions of a plurality of internal electrodes are the same, and a distance between the adjacent multilayer capacitors is ½ or less of a height of the multilayer capacitor mounted on the substrate.

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First Claim