PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 25, 2024
filing date -
Sep 25, 2024
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Abstract
An embodiment relates to a packaging substrate and a manufacturing method of the same. The packaging substrate according to an embodiment includes a glass core including a first surface and a second surface facing each other; and an upper layer stacked on the first surface or a lower layer stacked on the second surface, and the corners of the packaging substrate may be treated as curved surfaces or chamfered. Through this, it is possible to protect the glass core from external impact and minimize damage and damage to the glass core.
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