POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
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United States of America Patent
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Mar 27, 2025
app pub date -
Sep 26, 2023
filing date -
Sep 26, 2023
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Abstract
Embodiments disclosed herein include glass cores with through glass vias (TGVs). In an embodiment, an apparatus comprises a substrate that is a solid glass layer, and an opening through a thickness of the substrate. In an embodiment, a via structure is in the opening, where the via structure comprises a first region with an electrically conductive material with a first porosity, and a second region in contact with the first region, where the second region comprises an electrically conductive material with a second porosity that is less than the first porosity. In an embodiment, the second region is separated from a sidewall of the opening by the first region.
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