METHOD OF PROCESSING WAFER
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 17, 2024
filing date -
Sep 17, 2024
priority date (Note) -
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Abstract
A method is of processing a wafer that includes on a side of a front surface a plurality of intersecting planned dividing lines and a plurality of devices formed in respective areas defined by the planned dividing lines, and a metal layer laminated on a side of a back surface. The method includes: forming a mark indicating positions of the planned dividing lines of the wafer on the back surface; and dicing the wafer from the side of the back surface using the formed mark as a reference to divide the wafer into individual chips.
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