Embeddable Electrically Insulating Thermal Connector and Circuit Board Including the Same
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Dec 9, 2024
filing date -
Dec 9, 2024
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Abstract
A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.
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