NANOTWIN LINER FOR THROUGH GLASS VIAS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 25, 2023
filing date -
Sep 25, 2023
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Abstract
Embodiments disclosed herein include glass cores with through glass vias (TGVs). In an embodiment, an apparatus comprises a solid glass layer with an opening through a thickness of the layer, and a via in the opening. In an embodiment, the via comprises a first portion along sidewalls of the opening, where the first portion has a first microstructure, and a second portion in the opening, where the first portion surrounds the second portion, and where the second portion has a second microstructure that is different than the first microstructure.
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