ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Aug 21, 2024
filing date -
Aug 21, 2024
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Abstract
An electronic device is provided. The electronic device includes a substrate, a first metal layer, and a second metal layer. The first metal layer is disposed on the substrate. The first metal layer includes a first edge and a second edge. The second metal layer is disposed on the first metal layer. The first metal layer is located between the substrate and the second metal layer. The first edge does not overlap the second metal layer. The second edge overlaps the second metal layer. A side angle of the first edge is different from a side angle of the second edge. The side angle of the second edge is greater than or equal to 30 degrees and less than or equal to 45 degrees. A method of manufacturing an electronic device is also provided.
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