ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 27, 2025
app pub date -
Sep 26, 2023
filing date -
Sep 26, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Embodiments disclosed herein include glass cores with through glass vias (TGVs). In an embodiment, an apparatus comprises a substrate that is a solid glass layer. In an embodiment, an opening is provided through a thickness of the substrate, and a liner with a first surface is on a sidewall of the opening and a second surface is facing away from the sidewall of the opening. In an embodiment, the liner comprises a matrix, and filler particles in the matrix. In an embodiment, a plurality of cavities are provided into the second surface of the liner. In an embodiment, a via is in the opening, where the via is electrically conductive.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully