RF COVER LAYER

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20250107006A1
SERIAL NO

18471385

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A printed circuit board comprises a support structure, a conductive layer operably coupled to the support structure, a mask structure formed on the conductive layer, and a cover layer. The conductive layer comprises first and second portions of conductive material separated by a gap that defines a spacing between the first and second portions that does not contain conductive material. The mask structure defines first and second regions on the conductive layer. The first region is enclosed by a first boundary defined by the mask structure and includes the gap. The second region lies outside of the first boundary. The cover layer is sized to fit within the first region and comprises a laminatible insulating material that flows within the first region during lamination. During lamination, the first boundary prevents the laminatible insulating material from flowing into the second region, and the laminatible insulating material flows to fill the gap.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
RAYTHEON COMPANY870 WINTER STREET WALTHAM MA 02451-1449

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brailovsky, Alexander B Irvine, US 2 0
Henault, Philip M Medway, US 5 5
Puzella, Angelo M Marlborough, US 22 1063

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation