Forge Bonding Machine

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250108454A1
SERIAL NO

18979849

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Importance

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Abstract

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A forge bonding machine includes: a supporting body supporting a lower-surface side of bonding portion of members to be bonded in a state where the members are layered; a pressurizing body applying pressure on an upper-surface side of the bonding portion in the state where the members are layered; a stroke controller controlling a gap between the supporting and the pressurizing bodies; and a heater raising a temperature of the bonding portion to a predetermined temperature range by directly or indirectly coming into contact with the members, in which the stroke controller controls a reduction ratio R (T0/T1) that represents a ratio of a thickness T0 of the bonding portion before bonding to a thickness T1 after the bonding, and the supporting body or/and the pressurizing body comprise a rod controlled in terms of stroke toward the bonding portions by a displacement meter or a stopper.

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Patent Owner(s)

Patent OwnerAddress
TOYAMA PREFECTURE1-7 SHINSOUGAWA TOYAMA-SHI TOYAMA 930-0006
DENGENSHA TOA CO LTD1-23-1 MASUGATA TAMA-KU KAWASAKI-SHI KANAGAWA 214-8588

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HISADA, Yasukazu Konan-shi, JP 2 0
OMORI, Noburo Kawasaki-shi, JP 2 0
OTUBO, Takuya Konan-shi, JP 1 0
YAMAGISHI, Hideki Takaoka-shi, JP 21 252

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