NEGATIVE THERMAL EXPANSION MATERIAL, METHOD FOR PRODUCING THE SAME, AND COMPOSITE MATERIAL
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United States of America
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Apr 3, 2025
app pub date -
Feb 24, 2023
filing date -
Feb 24, 2023
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Abstract
An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising copper vanadium composite oxide powder dissolving Al atoms and represented by the following general formula (1), CuxMyVzOt (1). In general formula (1), M represents a metallic element with an atomic number of 11 or more other than Cu, V, and Al, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.70≤z≤2.30, 6.00≤t≤9.00, 1.00≤x+y≤3.00, and a molar number of the Al atoms in terms of atoms>a molar number of M atoms in terms of atoms if an M element is contained.
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