CROSS-LINKED HYDROPHOBIC COATING WITH PLASMA RESISTANCE FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 28, 2023
filing date -
Sep 28, 2023
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Abstract
Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. One or both of an integrated circuit (IC) die hybrid bonding region and a base substrate hybrid bonding region surrounded by hydrophobic structures that include a cross-linked material. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. A hybrid bond is formed by evaporating the droplet and a subsequent anneal. The cross-linked material hydrophobic structures contain the liquid droplet for alignment and are resistant to plasma treatment prior to bonding.
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