THERMALLY EXPANDABLE MICROCAPSULES, FOAMABLE RESIN COMPOSITION, AND FOAM
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Jan 18, 2023
filing date -
Jan 18, 2023
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Abstract
The present invention provides a thermally expandable microcapsule that enables the production of a light molded article with high expansion ratio and excellent appearance, as well as a foamable resin composition and a foam that are produced using the thermally expandable microcapsule. Provided is a thermally expandable microcapsule including: a shell containing a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell containing silicon dioxide and a polymer obtained by polymerizing a monomer composition containing a carbonyl group-containing monomer, the thermally expandable microcapsule having a volatile content of 0.55% by weight or more and 2% by weight or less upon standing for one hour at a temperature of 70° C.
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