THERMALLY PROCESSIBLE PIEZOELECTRIC COMPOSITIONS CONTAINING A THERMAL CROSSLINKING AGENT AND METHODS ASSOCIATED THEREWITH
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Oct 2, 2023
filing date -
Oct 2, 2023
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Abstract
Parts having piezoelectric properties may be formed using compositions comprising a plurality of piezoelectric particles dispersed in at least a portion of a polymer material comprising at least one thermoplastic polymer, and at least one thermal crosslinking agent dispersed in at least a portion of the polymer material. The composition is formable at a melt processing temperature that is at or above a melting point or softening temperature of the at least one thermoplastic polymer for a melt processing time that retains at least a majority of the at least one thermal crosslinking agent in a non-crosslinked state. The at least one thermal crosslinking agent may be present in the polymer material a) covalently bonded to at least a portion of the polymer material, b) covalently bonded to at least a portion of the piezoelectric particles, or c) any combination thereof.
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