Importance

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Abstract

An object of the present invention is to provide a novel polishing composition capable of reducing remaining of an object to be polished, which has to be polished, such as polysilicon, and suppressing recesses. There is provided a polishing composition containing colloidal silica, an alkali metal salt, and water, a pH of the polishing composition being 9.0 to 11.5, wherein (i) in an object to be polished including a first layer provided with a recess portion and a second layer formed to fill the inside of the recess portion, the polishing composition is used for a step of polishing the second layer to expose the first layer, the first layer is selected from a layer having an oxygen-silicon bond and a layer having a nitrogen-silicon bond, and the second layer has a silicon-silicon bond, and/or (ii) the number of silanol groups in the colloidal silica is 6/nm² or more and 22/nm² or less.

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First Claim