POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Apr 3, 2025
app pub date -
Sep 28, 2023
filing date -
Sep 28, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method includes providing a wafer including a layer; projecting a beam for a surface treatment on the layer to form a material-modified portion at a top of the layer, wherein the material-modified portion is spaced apart from a bottom surface of the layer; and polishing, by using a polishing pad, the material-modified portion of the layer.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully