Importance

Loading Importance Indicators...

Abstract

A wafer thinning tape and a preparation method thereof, and a wafer grinding method are provided. The wafer thinning tape includes a tape layer, a base film layer, and a conductive coating that are successively stacked, where the base film layer and the conductive coating constitute an antistatic base film; the raw materials of the tape layer include acrylic adhesive, curing agent, and antistatic agent, and the mass dosage of curing agent is 3%-4% that of the acrylic adhesive, and the mass dosage of antistatic agent is 1%-2% that of the acrylic adhesive; the base film layer is TPU film; the conductive coating is silver nanowire coating. The wafer thinning tape can be applied to wafer grinding, has excellent antistatic property, and can effectively inhibit the peeling static electricity; at the same time, it also has the advantages of peeling without residue and preventing water penetration.

Loading the Abstract Image...

First Claim