THERMAL MANAGEMENT CIRCUIT

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250112298A1
SERIAL NO

18757943

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The thermal management circuit includes a battery circuit (first circuit), a refrigeration cycle, and a heat dissipation circuit (second circuit). The heat dissipation circuit includes a flow path (first flow path), a flow path (second flow path), and a flow path (third flow path). The flow path connects the port (outlet port) of the condensing portion and the upstream-side HT radiator (upstream-side radiator). The flow path branches from a flow path connecting the upstream-side HT radiator and the downstream-side HT radiator (downstream-side radiator), and is connected to a port (inlet port) of the condensing portion. The flow path connects a port (inlet port) of the subcooling unit (supercooling portion) to the downstream-side HT radiator.

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHATOYOTA-SHI AICHI 471-8571

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AIKAWA, Hidefumi Okazaki-shi, JP 32 161
IKEGAMI, Makoto Obu-shi, JP 57 744

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