CIRCUIT BOARD DEVICE AND ITS CIRCUIT MODULE
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Dec 18, 2023
filing date -
Dec 18, 2023
priority date (Note) -
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Abstract
A circuit board device includes a multilayer board structure, a main ground and a circuit module. The main ground is configured in the multilayer board structure. The circuit module includes two differential-signal portions. These differential-signal portions are all located on one core layer of the multilayer board structure. Each of the differential-signal portions includes a differential through-hole pair and a plurality of ground through holes, and these ground through holes are arranged at intervals to surround the differential through-hole pair, and are electrically connected to the main ground. The patterns of the differential-signal portions are mirror symmetrical to each other based on an imaginary mirror line therebetween, and the minimum linear distances from the differential-signal portions to the imaginary mirror line are equal to each other.
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