THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION
Number of patents in Portfolio can not be more than 2000
United States of America
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Apr 3, 2025
app pub date -
Sep 28, 2023
filing date -
Sep 28, 2023
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Abstract
Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface, and the substrate is a solid glass layer. In an embodiment, an opening is provided through a thickness of the substrate, where the opening comprises a sidewall that is non-orthogonal with the first surface of the substrate. In an embodiment a corner at a junction between the sidewall and the first surface is rounded. In an embodiment, a via is provided in the opening, where the via is electrically conductive.
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