Importance

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Abstract

A wiring board includes a first interconnect structure including a first interconnect layer and a first insulating layer, a second interconnect structure, including a second interconnect layer and a second insulating layer, and laminated on one side of the first interconnect structure, and a third interconnect structure, including a third interconnect layer and a third insulating layer, and laminated on the other side of the first interconnect structure. The second interconnect layer has an interconnect density higher than those of the first and the third interconnect layers. The first insulating layer has a through hole penetrating the first insulating layer, and an electronic component electrically connected to the second interconnect layer is disposed inside the through hole. An embedding resin covering the electronic component is provided inside the through hole, and extends to cover the first insulating layer and fills in between the first and second insulating layers.

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First Claim