SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL PROPERTIES OF A METAL MATERIAL UTILIZED IN A DEFORMABLE CIRCUIT
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Oct 2, 2023
filing date -
Oct 2, 2023
priority date (Note) -
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Abstract
The present disclosure provides systems, methods, and devices for producing an interconnect. A method of manufacturing an electronic device includes forming a first circuit component at a first portion of a deformable substrate. The method further includes forming a second circuit component at a second portion of the deformable substrate. Additionally, the method includes electronically coupling the first circuit component and the second circuit component with a composition. The composition includes a first metal material further including a first weight percent (w %) of the composition. the first metal material is gallium indium alloy, gallium tin alloy, gallium indium tin alloy, gallium indium tin zinc alloy, or a combination thereof. The composition includes a filler material disposed within the first metal material. The filler material includes a second w % of the composition. Accordingly, the method forms an interconnect between the first circuit component and the second circuit component.
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