PLATED THROUGH-HOLE STRUCTURES AND METHOD FOR THE MANUFACTURE THEREOF
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 30, 2024
filing date -
Sep 30, 2024
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Abstract
A method for forming a plated through-hole structure includes filling a first through-hole in a substrate with a composition having a coefficient of thermal expansion of less than 50 ppm/° C. The composition is disposed on the interior surface of the first through-hole from the first opening to the second opening. The method further includes forming a second through-hole in the first through-hole filled with the composition. The second through-hole has a diameter less than a diameter of the first through-hole. The method further includes plating the interior surface of the second through-hole to provide the plated through-hole structure. The method can provide plated through-hole structures exhibiting good adhesion to metal and providing a reliable electrical connection.
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