SUBSTRATE PROCESSING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250114812A1
SERIAL NO

18906149

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus includes: a plurality of first mist nozzles provided inside a chamber and arranged at a predetermined second interval along an arrangement of a plurality of substrates; and a plurality of second mist nozzles provided inside the chamber and arranged at the second interval along the arrangement of the plurality of substrates. The first mist nozzles are disposed on opposite sides of the second mist nozzles, with respect to the substrates in plan view. The first and second mist nozzles are disposed in a manner facing the substrates in plan view. The first mist nozzles are arranged in a manner offset from the respective second mist nozzles by a length corresponding to a half the second interval in the direction of the arrangement of the substrates W. Each of the first and second mist nozzles sprays the liquid as at least one of mist and droplets.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDKYOTO JAPAN KYOTO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKIYAMA, Takashi Kyoto, JP 186 1988
EDAMITSU, Kenji Kyoto, JP 13 14
ITO, Akira Kyoto, JP 521 5667
IWATA, Keiji Kyoto, JP 35 192
NAGAI, Yasuhiko Kyoto, JP 26 854
YAMAMOTO, Shigeru Kyoto, JP 196 2415

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