COMPOSITION FOR USE IN SINTERED MOLDED BODIES, GREEN MOLDED BODY, AND SINTERED MOLDED BODY

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250114840A1
SERIAL NO

18835017

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Abstract

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An object is to provide a composition for use in sintered molded bodies that enables an organic binder to be degreased in a short time without requiring a special facility or step, does not cause mold deposit during molding, and suppresses cracking and swelling during molding and after sintering. In order to achieve the above-mentioned object, the present disclosure is a composition for use in sintered molded bodies containing a sinterable inorganic powder and an organic binder, wherein the organic binder contains at least a polyacetal resin, a polyolefin resin and an epoxy resin, and a total end amount with respect to all polyoxymethylene units in the polyacetal resin is 0.1 mol % or more and 0.75 mol % or less.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI KABUSHIKI KAISHATOKYO 100-0006
MOULAGE LLCIKENOHATA HIROHEIGHTS 2F 2-12-18 UENO TAITOU-KU TOKYO 1100005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUKAI, Motohiro Chiyoda-ku, Tokyo, JP 4 0
KANKAWA, Yoshimitsu Taitou-ku, Tokyo, JP 4 43
MIYAZAKI, Kuon Chiyoda-ku, Tokyo, JP 12 54

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