PREPARATION METHOD OF COPPER FOAM

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United States of America

APP PUB NO 20250114841A1
SERIAL NO

17922979

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Abstract

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A preparation method of copper foam includes coating copper paste on a release film to form a coating sheet with a thickness of 50-200 μm on the release film, peeling off the release film to obtain a copper foam preform after drying the release film with the coating sheet, and performing a glue discharging process on the copper foam preform and sintering the copper foam preform to obtain the copper foam having a thickness of 30-120 μm and having a porosity of 50-80%. The thickness of the copper foam is reduced, which ensures a balance between the porosity and a structural strength of the copper foam, so the copper foam has a good water absorption performance, and a heat dissipation performance of the copper foam is effectively improved.

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Patent Owner(s)

Patent OwnerAddress
AAC TECHNOLOGIES (NANJING) CO LTD8TH FLOOR XINYAN BUILDING NO 8 YUANHUA ROAD XIANLIN COLLEGE TOWN QIXIA DISTRICT NANJING CITY JIANGSU PROVINCE P R CHINA NANJING

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Guochuang Shenzhen, CN 8 11
Zhang, Bo Shenzhen, CN 1006 7322

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