Importance

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Abstract

An edge trimming method for removing a chamfered portion on an outer periphery of a grinding-object wafer in a bonded wafer is provided. The method includes a holding process to hold the bonded wafer on a chuck table, a finishing-grindstone mark forming process to form a finishing-grindstone mark in the grinding-object wafer with the finishing grindstone, a finishing-grindstone mark height measuring process to measure a height of a bottom of the finishing-grindstone mark with a height measurer, a finishing-grindstone height calculating process to calculate a height of the finishing grindstone based on the measured height of the bottom, a rough-grinding process to lower the rough grindstone and rotate the bonded wafer to roughly grind the grinding-object wafer with the rough grindstone, and a finish-grinding process to lower the finishing grindstone to the calculated height and rotate the bonded wafer to finely grind the grinding-object wafer with the finishing grindstone.

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First Claim