EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL POLISHING
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 6, 2023
filing date -
Oct 6, 2023
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Abstract
A polishing pad has a polishing layer having a polishing surface that has a circular central region and an annular outer region surrounding the central region. The polishing surface can include slurry distribution grooves formed with uniformity spacing across the central region and the annular outer region, and slurry discharge grooves that start at an outer perimeter of the circular central region and extend radially outward to an edge of the polishing pad so as to preferentially discharge the polishing liquid from the annular outer region. The central region can be formed of a first polishing material and the annular outer region can be formed of a second polishing material that is softer than the first polishing material.
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