RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 6, 2023
filing date -
Oct 6, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A method for chemical mechanical polishing includes bringing a substrate into contact with a polishing pad, causing relative motion between the substrate and polishing pad, dispensing a polishing liquid onto the polishing pad, holding the substrate in a lateral position with a retaining ring secured to a carrier head, and rotating the carrier head about an axis of rotation. The retaining ring has a plurality of channels extending from an inner diameter surface of the retaining ring to an outer diameter surface of the retaining ring such that rotation cause the polishing liquid to be preferentially expelled from a region below an outer edge of the substrate through the plurality of channels.
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