CMP WITH INDIVIDUALLY ROTATABLE PLATENS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 5, 2023
filing date -
Oct 5, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A chemical mechanical polishing apparatus includes an inner platen to support an inner polishing pad, aan annular outer platen to support an outer polishing pad, a carrier head to hold a substrate, a first motor to rotate the inner platen about a vertical axis at a first rotation rate, and a second motor to rotate the outer platen about the vertical axis at a second rotation rate. The outer polishing pad coaxially surrounds the inner platen, and an outer edge of the inner platen and an inner edge of the outer platen are separated by a gap.
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