RETAINING-RING-LESS CMP PROCESS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 10, 2023
filing date -
Oct 10, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a flexible membrane coupled with the carrier body. The flexible membrane may include a substrate-receiving surface that faces away from the carrier body. The substrate-receiving surface may include a plurality of gripping elements that protrude away from the substrate-receiving surface. Each of the plurality of gripping elements may have a maximum lateral dimension that is no greater than 2 mm.
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