POLYAMIDE RESIN COMPOSITION, MOLDED ARTICLE OBTAINED BY MOLDING SAME, AND METHODS FOR PRODUCING THOSE
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 22, 2022
filing date -
Dec 22, 2022
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Abstract
The present invention pertains to: a polyamide resin composition obtained by compounding, with respect to 100 parts by weight of a polyamide resin (A), 0.01-12 parts by weight of a silicone resin (B) and 0.01-5 parts by weight of a silane coupling agent (C) having at least one functional group selected from the group consisting of an isocyanate group, an epoxy group, and an acid anhydride group; a molded article thereof; and methods for producing the composition and the molded article. Provided is a polyamide resin composition which, even if the polyamide resin composition contains a silicone resin as an impurity, can suppress detachment of the silicone resin from a molded article obtained through injection molding of the polyamide resin composition and can suppress adhesion of the silicone resin to the surface of a mold during molding, and a molded article from which also can have excellent mechanical properties.
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