THERMALLY CONDUCTIVE SILICONE COMPOSITION AND PRODUCTION METHOD THEREFOR
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Jan 16, 2023
filing date -
Jan 16, 2023
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Abstract
A thermally conductive silicone composition comprising
- (A) a crosslinked silicone gel,(B) a silicone oil containing neither an aliphatic unsaturated bond nor an SiH group,(C) a thermally conductive filler having an average particle diameter of 0.01-100 μm, the amount of which is 10-2,000 parts by mass per 100 parts by mass of the sum of the (A) and (B) components, and(D) gallium or a gallium alloy having a melting point of −20 to 100° C., the amount of which is 1,000-10,000 parts by mass per 100 parts by mass of the sum of the (A) and (B) components.
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