MOISTURE CURABLE POLYURETHANE HOT-MELT ADHESIVE HAVING IMPROVED HEAT STABILITY

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United States of America

APP PUB NO 20250115794A1
SERIAL NO

18730184

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Abstract

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A moisture curable adhesive composition including at least 65 wt.-% of at least one isocyanate-functional polyurethane polymer P obtained by reacting: (a) a polyol composition including (a1) at least one polyester polyol PO1, (a2) at least one polyether polyol PO2, and (b) at least one polyisocyanate PI, wherein the adhesive composition further includes at least one non-functionalized thermoplastic polymer TP having a softening point determined by Ring and Ball method according to ISO 4625 standard of 70-200° C., preferably 75-185° C. The adhesive composition can also be used for bonding of substrates in production of white goods, automotive vehicles, and electronic devices.

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Patent Owner(s)

Patent OwnerAddress
SIKA TECHNOLOGY AG6340 BAAR

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JENDOUBI, Elyes Tokyo, JP 14 12
TONG, Paul Suzhou, CN 1 0
ZHANG, Weiming Suzhou, CN 58 225

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