SEALING RING

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250116332A1
SERIAL NO

18620395

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Abstract

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A substrate processing apparatus includes an O-ring defined by a central axis, a first guide ring located closer to the central axis than is the O-ring, and a second guide ring located further from the central axis than is the O-ring. A thickness of each of the first guide ring and the second guide ring becomes progressively greater further from the central axis.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO ROAD SOUTH KOREA SAMSUNG SUWON CITY LINGTONG DISTRICT NO 129 SUWON GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Seunghee Suwon-si, KR 8 1
Han, Dongseok Suwon-si, Gyeonggi-do, KR 7 5
Jang, Woojin Suwon-si, KR 18 62
Kim, Jihwan Suwon-si, Gyeonggi-do, KR 248 5241
Kim, Kyung-Sun Suwon-si, KR 32 152
Kim, Mingil Suwon-si, KR 2 0
Kim, Yirop Suwon-si, KR 3 0
Min, Heewon Suwon-si, KR 7 7
Song, Junghyun Suwon-si, KR 8 14
Yoon, Kuihyun Suwon-si, KR 13 4

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