PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
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United States of America
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Apr 10, 2025
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Jan 18, 2023
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Jan 18, 2023
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Abstract
A photosensitive resin composition for a permanent resist according to the present disclosure contains an acid-modified vinyl group-containing resin (A), a thermosetting resin (B), a photopolymerization initiator (C), a photopolymerizable compound (D), and an elastomer (H), the photopolymerizable compound includes a photopolymerizable compound having an isocyanuric skeleton, and the elastomer includes a liquid elastomer or a granular elastomer having an average particle size of less than 4 μm.
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