PHOTORESIST COMPOSITION

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250116931A1
SERIAL NO

18484051

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Abstract

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A photoresist composition includes a solvent and a polymer. The polymer comprises a polymer backbone, an acid labile group monomer, a photo acid generator monomer and a quencher monomer. The acid labile group monomer is bonded to the polymer backbone. The acid labile group monomer is acid cleavable. The photo acid generator monomer is bonded to the polymer backbone. The quencher monomer is bonded to the polymer backbone.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Ching-Yu Yilang County, TW 578 7902
Lai, Wei-Han New Taipei City, TW 71 130
Weng, Ming-Hui New Taipei City, TW 50 58

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