RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN

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United States of America

APP PUB NO 20250116935A1
SERIAL NO

18906361

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A radiation-sensitive resin composition includes: a first polymer and a compound. A solubility of the first polymer in a developer solution is capable of being altered by an action of an acid. The first polymer includes: a first structural unit containing a partial structure obtained by substituting a hydrogen atom of a carboxy group, a phenolic hydroxy group, or an amide group with a group represented by the following formula (1); and a second structural unit containing a phenolic hydroxy group. The compound includes: a monovalent radiation-sensitive onium cation containing an aromatic ring obtained by substituting at least one hydrogen atom with a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion.

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Patent Owner(s)

Patent OwnerAddress
JSR CORPORATIONMINATO-KU TOKYO 105-8640

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NISHIKORI, Katsuaki Tokyo, JP 27 10
TOMIHAMA, Munehisa Tokyo, JP 1 0
WATANABE, Daichi Tokyo, JP 48 303

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