FLEX PCB WINDING WITH THERMAL COOLING
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United States of America Patent
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Issued Date -
Apr 10, 2025
app pub date -
Sep 26, 2024
filing date -
Sep 26, 2024
priority date (Note) -
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Abstract
The present disclosure provides a wireless power transfer system and a wireless power transfer assembly. In one aspect, a wireless power transfer assembly includes a flexible printed circuit board, which is also referred to as a flexible printed circuit board structure. The flexible printed circuit board includes a litz winding. The litz winding has multiple layers of electrically insulated strands. The wireless power transfer assembly also includes a ceramic heat sink. The ceramic heat sink is arranged relative to the flexible printed circuit board in a manner that dissipates heat away from the litz winding. In another aspect, a wireless power transfer system includes a transmit unit or receive unit having an input stage, a resonator, and the wireless power transfer assembly.
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